As the AMD presentation at Computex 2022 approaches, rumors regarding some of the impending product announcements continue to circulate.

Over the last several days, we’ve learned about a new class of chipset known as “X670E,” which will replace the X670, which has traditionally been the flagship.

Furthermore, there has been additional confirmation of a dual-chipset architecture for X670E and X670 Socket AM5 boards, which may aid in greater signal integrity and conditioning, as well as simpler cooling.

With the launch now less than a day away, VideoCardz has provided us with information on the final piece of the puzzle, the Zen 4-based Ryzen 7000 series CPUs themselves.

According to the rumor, AMD’s Zen 4 CPUs would have a 15% increase in instructions per cycle (IPC). This is lower than previously released figures that predicted an 18% IPC boost.

However, as with the last report, the frame of reference for comparison isn’t supplied here, so it’s unclear what the 15% growth is being compared to. The 15% IPC might be compared to Zen 3 (Ryzen 5000), Zen 3+ (Ryzen 6000), or Zen3D. (Ryzen 7 5800X3D). The size of the L2 cache has also been increased.

Two 5nm Zen 4 core chiplets and a 6nm IO die will make up the chip packaging.

Interestingly, the rumor says that RDNA 2 integrated graphics would also be present on board, which is unusual given AMD’s history of releasing non-APU desktop components first. The Ryzen 7000 Raphael CPUs will be available “this autumn.”

AMD will also push clock rates over 5GHz for the first time with the Ryzen 7000 series. AM5 is designed to support CPUs with up to 170W TDP, which might be one of the reasons AMD built its new X670E chipset. However, the source adds that 170W SKUs for the future Ryzen 7000 CPUs are not listed.