According to leaks, a new Xiaomi Foldable will arrive in Q4 with a snapdragon 888 chipset and an improved hinge.

Xiaomi launched its first foldable smartphone in March, and according to leaks, the company is already working on a follow-up.

According to one source, the new device will pack a Snapdragon 888 chipset, a 5,000 mAh battery, and a 108MP camera, but will bring an improved hinge.

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The whole internal structure of the next Mi Mix Fold is already being tested. The foldable itself will have an inward hinge and will have two displays – one big on the inside, built by Samsung and coming with a 120Hz refresh rate, and a smaller one on the outside with 90Hz, manufactured by Visionox.

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