Redmi has announced the launch of its upcoming Redmi Turbo 4, scheduled for January 2025 in China. It will be the first smartphone to feature the MediaTek Dimensity 8400-Ultra processor, promising enhanced performance, better power efficiency, and advanced AI capabilities.

The Redmi Turbo 4 is expected to sport a sleek design with a flat display and slim bezels, along with a dual rear camera setup for immersive viewing and modern aesthetics.

Meanwhile, Realme is also gearing up to introduce its Neo 7 SE, following the release of the Neo 7 earlier this month. While the company has yet to confirm details, leaks from a trusted source, Digital Chat Station, suggest the Neo 7 SE will also be powered by the Dimensity 8400 chipset.

The Dimensity 8400 chipset, built with eight Arm Cortex-A725 cores and a Mali-G720 GPU, ensures smooth multitasking and exceptional graphics. Its Imagiq 1080 ISP enhances low-light photography and supports camera sensors up to 320MP, providing flagship-level imaging capabilities.

Both smartphones are set to revolutionize the mid-range segment by offering performance and features that cater to media-intensive and AI-driven tasks. With sleek designs and powerful hardware, they promise to be compelling choices for tech enthusiasts.

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