Next Qualcomm Flagship Chip Could Be Manufactured by Samsung
Qualcomm Snapdragon 888+ is manufactured using Samsung’s 5nm LPE process. It looks...
Qualcomm surprised us by introducing the SD 888 as the successor of Snapdragon 865, instead of SD 875. The next flagship processor will arrive as Snapdragon 895 but a recent report says that will not be the case. Instead, Qualcomm will introduce its next processor as Snapdragon 898.
The leak was given by a famous Chinese leakster, IceUniverse, who said on Weibo that the next-gen flagship chipset by Qualcomm will be called Snapdragon 898.
He also said that the prime core is expected to be based on Cortex-X2, which will be clocked at 3.09GHz.
It will be a 4nm chipset that will be manufactured by Samsung. The new chipset’s higher clock plus variant is expected to arrive in mid-2022. It will be manufactured by TSMC.
Qualcomm is also expected to go with a different CPU cluster from that of the Snapdragon 888. Instead of a 1+3+4 CPU cluster, a leak from a few weeks ago revealed that the Snapdragon 898 will have a 1+3+2+2 CPU cluster. This translates to: 1x Cortex-X2 prime core + 3x Cortex-A710 cores + 2x Cortex-A510 cores + 2x Cortex-A510 cores (at a lower clock speed).
The Snapdragon 898 or whatever it ends up being called should be announced in December.
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